In the design of the sensor housing assembly interface, accurate dimension design is the basis for ensuring accurate fit with internal components. First, the dimensions of the internal components need to be accurately measured, including length, width, height, and dimensions of various connection parts. Then, based on these measurement data, the matching assembly interface dimensions are designed. For example, for the sensor circuit board, the interface dimensions on the sensor housing must be accurate enough to allow the circuit board to be embedded exactly. It should not be too loose to cause the circuit board to shake in the shell, affecting the performance stability of the sensor, nor too compact to make the circuit board difficult to install, and may even damage the circuit board or sensor housing. At the same time, for some internal components with specific shape requirements, such as cylindrical sensor probes, the assembly interface should also be designed into a shape that is compatible with it to ensure that the components can be accurately installed in place.
Since there will inevitably be certain tolerances in the manufacturing process, tolerance and fit issues must be fully considered when designing the assembly interface. Generally speaking, a reasonable tolerance range will be determined based on the accuracy requirements of the internal components and the actual conditions of the production process. For key fitting parts, such as the fit between pins and sockets, transition fit or interference fit is usually used to ensure the reliability and stability of the connection. For example, the diameter tolerance of the pin and the socket may be controlled within ±0.05mm, which can ensure that the pin can be smoothly inserted into the socket and maintain close contact after insertion to prevent looseness or poor contact. At the same time, for some non-critical mating parts, clearance fit can be used to facilitate assembly and disassembly.
In order to achieve accurate positioning of internal components in the sensor housing, a reasonable positioning structure needs to be designed. Common positioning structures include positioning pins, positioning grooves, bosses, etc. For example, positioning pins are set on the sensor housing, and positioning holes are set at corresponding positions on the circuit board. When the circuit board is installed in the sensor housing, the positioning pins are inserted into the positioning holes, which can accurately determine the position of the circuit board and prevent it from shifting during assembly. Similarly, positioning grooves and bosses can also play a similar role. By cooperating with the corresponding structures on the internal components, the components can be accurately positioned in the sensor housing. Moreover, the design of the positioning structure also needs to consider its strength and stability to ensure that the internal components can always remain in the correct position during transportation, installation and use.
Different materials have different characteristics such as thermal expansion coefficient and elastic modulus. At different working environment temperatures, the sensor housing and internal components may deform to different degrees. Therefore, when designing the assembly interface, it is necessary to consider the impact of material properties on the adaptation and make corresponding deformation compensation designs. For example, if the sensor housing is made of plastic material, and some parts of the internal components are made of metal material, since the thermal expansion coefficient of plastic is generally larger than that of metal, under the condition of large temperature changes, the assembly interface may become loose or too tight. To avoid this situation, a certain compensation gap can be reserved in the interface design, or some elastic materials can be used to make some parts of the interface to adapt to the deformation differences of different materials and ensure accurate adaptation at various working temperatures.
The design of the assembly interface also needs to match the actual assembly process. For example, if an automated assembly process is used, the interface design should be convenient for operation by robots or automated equipment, such as the shape and position of the interface should be convenient for grasping and inserting tools. At the same time, the order and steps in the assembly process should be considered to avoid assembly conflicts or difficult operations. In addition, for some assembly interfaces that need to be sealed, such as the interface between the sensor housing and the probe, a suitable sealing structure, such as a sealing ring groove, should be designed, and how to ensure the reliability of the seal during the assembly process to avoid leakage and other problems should be considered.
In order to prevent misassembly during the assembly process, the assembly interface design can adopt a fool-proof design. For example, by setting a special shape, mark or asymmetric structure at the interface, only the correct components can be matched with the interface. For example, the interface is designed to be asymmetric, or a specific mark is set on the interface, and only the corresponding internal components can be installed in the correct direction and position. This can effectively avoid assembly errors caused by human negligence or misoperation, and improve the accuracy and efficiency of assembly.
After completing the assembly interface design, a series of tests and verifications are required to ensure that it can achieve accurate adaptation with the internal components. First, sample production and assembly tests are carried out to observe the installation of internal components in the sensor housing, and check whether there are problems such as assembly difficulties and loose fit. Then, performance tests are carried out, such as electrical performance tests and accuracy tests on the sensor, to verify whether the sensor can work normally in the assembled state and whether the performance meets the requirements. In addition, environmental simulation tests are also required, such as high temperature, low temperature, humidity and other environmental tests, to observe the adaptation of the assembly interface and the performance stability of the sensor under different environmental conditions. Through continuous testing and improvement, it is ultimately ensured that the assembly interface design can meet the requirements of precise adaptation with internal components, ensuring the reliability and performance of the sensor.
